Semiconductor Packaging : Materials Interaction and Reliability, Paperback by…

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Semiconductor Packaging : Materials Interaction and Reliability, Paperback by Chen, Andrea; Lo, Randy Hsiao-yu, ISBN 113807540X, ISBN-13 9781138075405, Like New Used, Free shipping in the US This easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

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Surface and Underground Excavations : Methods, Techniques and Equipment, Pape…

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Surface and Underground Excavations : Methods, Techniques and Equipment, Paperback by Tatiya, Ratan Raj, ., ISBN 1138496162, ISBN-13 9781138496163, Like New Used, Free shipping in the US This comprehensive text explores the technologies and developments in excavations for any type of surface or underground excavation. Chapters cover various unit operations as well as excavation techniques. Different aspects of design, planning, and analysis as well as the construction of excavations are revised, expanded second edition.

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